Developers need compact and flexible hardware to build and deploy artificial intelligence (AI) solutions at the edge. The AI Development Kit series from AAEON’s UP brand addresses this with Intel processors, optional AI accelerators, and rich I/O for applications such as machine vision, robotics, and industrial automation. The lineup includes the UP TWL AI Dev Kit, UP Squared Pro TWL AI Dev Kit, and UP Xtreme ARL AI Dev Kit, covering entry-level, mid-range, and high-end requirements. This range provides a clear upgrade path, allowing users to start small and scale as project demands grow.
Each kit ships as a ready-to-use package with the board, RAM, storage, and a USB HD camera. They come pre-installed with Ubuntu Pro 24.04 LTS, along with the NX AI Manager and UP AI Toolkit for model deployment, benchmarking, and unified runtime setup. Designed for edge computing, these development kits combine performance and convenience in a single-board format tailored to modern AI workloads.
UP TWL AI Development Kit
The UP TWL AI Development Kit is a cost-effective solution for developers exploring edge AI applications. Powered by the Intel Processor N150 (Twin Lake) with 24 Execution Units (EU), it supports entry-level AI workloads such as vision, automation, and robotics. The board integrates TPM 2.0 for security and comes in a card-sized form factor, making it a compact yet flexible platform for innovation.
UP Squared Pro TWL AI Dev Kit
The UP Squared Pro TWL AI Development Kit delivers higher AI performance in a compact Palm+ sized board. Powered by the Intel Processor N150 (Twin Lake) with 24 Execution Units (EU), it supports AI workloads with optional accelerator modules that scale performance up to 214 TOPS using the Axelera Metis AI card. The kit also supports camera integration through the UP RPI MIPI camera converter, making it a flexible platform for edge AI applications.
UP Xtreme ARL AI Dev Kit
The UP Xtreme ARL AI Development Kit is designed for advanced edge AI applications, powered by the Intel Core Ultra 5 Processor 225H with 14 cores. It integrates an Intel Arc 130T GPU and built-in NPU to deliver up to 83 TOPS of AI performance. The kit also supports expandability through the UP RPI MIPI camera converter and additional AI modules via M.2 slots, making it a scalable solution for demanding AI workloads.
Boards specifications:
All three UP AI Development Kits share several hardware features. Each includes TPM 2.0 for security and relies on an active heatsink for cooling. The kits support expandability through M.2 slots for modules or accelerators, with the higher-end boards offering greater bandwidth options. Camera support is also standard, with a USB HD camera included, while the UP Squared Pro TWL and UP Xtreme ARL kits extend this with MIPI-CSI connectivity for advanced vision applications.
Table: Differences Across Kits
| Feature | UP TWL AI Dev Kit (Entry) | UP Squared Pro TWL AI Dev Kit (Mid) | UP Xtreme ARL AI Dev Kit (High-end) |
|---|---|---|---|
| Processor | Intel N150 (“Twin Lake”), 4C/4T, up to ~3.6 GHz | Same Intel N150 base, with support for external AI accelerator modules | Intel Core Ultra 5 225H (Arrow Lake), 14 cores with integrated GPU + NPU (83 TOPS) |
| AI Performance | Basic CPU/GPU performance | Up to ~214 TOPS with plug-in accelerator modules | Native ~83 TOPS, expandable with extra modules |
| Memory and Storage | 8 GB RAM, 64 GB eMMC | Same base, plus NVMe and additional I/O options | 16 GB RAM, 256 GB PCIe Gen4 SSD, further options |
| I/O and Display Outputs | Limited I/O, fewer USB 3.x ports and display options | Improved I/O with dual 2.5GbE and triple 4K displays | Rich I/O with HDMI 2.1, DisplayPort, USB variety, dual LAN, and more |
| Power and Size | Low power, compact entry-level dimensions | Moderate power, ~101.6 mm square footprint | 9–36 V input, larger 120 × 122.5 mm board, heavier design |
The software ecosystem of the UP AI Development Kits is designed to streamline both development and deployment. Each kit comes with Ubuntu Pro 24.04 LTS preinstalled as the operating system, along with the NX AI Manager and UP AI Software Toolkit. These tools provide a unified runtime environment, model conversion utilities, and embedded benchmarking support. For AI workloads, developers can leverage OpenVINO and integrate accelerator modules such as Hailo-8L, DEEPX DX-M1, or Axelera Metis, depending on the kit.
The UP AI Development Kits are offered at different price points based on performance. The UP TWL AI Dev Kit is listed at $279, though availability is still TBD. The UP Squared Pro TWL starts at $469, with final pricing depending on the chosen accelerator module (Hailo-8L, DEEPX DX-M1, or Axelera Metis). For high-performance needs, the UP Xtreme ARL is available now at $899.
Images used courtesy of up-shop, and thanks to embeddednewshub.
Niladri Chowdhury