Since the advent of industrial automation and artificial intelligence, the process of decentralisation of data centres and reaching the edge, smaller, more powerful, and energy-efficient hardware has never been more in demand. Innovation Frontier Leading is Innodisk Corporation with the newest flagship solution, the EXMP-Q911. This COM-HPC Mini module, developed with Qualcomm Technologies, is developed to be able to redefine what can be done with on-device AI computing in challenging environments.
Make sure to go through our previously covered Qualcomm-based products for your reference, such as the STMicroelectronics ST67W611M1 series IoT module and the Radxa Dragon Q6A SBC.
Unprecedented AI Performance
The core of the EXMP-Q911 is the strong Qualcomm Dragonwing IQ-9075 SoC, an 8-core Kryo Gen 6 CPU and an Adreno 663 GPU, but the highlight is a separate Hexagon NPU. This engine provides an astounding 100 TOPS (Dense) or more than 200 TOPS (Sparse). In pragmatic terms, this enables the module to attain up to 10 times the frame rates of the AI inference of analogous modules, making it a perfect engine in all(autonomous) Mobile Robots (AMR), Automated Guided Vehicles (AGV), and Large Language Models (LLM) in the edge.
Industrial-Grade Reliability and Longevity
The EXMP-Q911 is designed not only to run fast, but it was designed to live. The two no bigger than the COM-HPC Mini form factor (95 x 70mm) module is compatible in extreme environments, and has a standard temperature span of -40 o C to 85 o C. In pursuit of long-term investments in industry, Innodisk and Qualcomm have ensured the longevity of chipsets up to 2038, making both companies a supply for almost 15 years.
Comprehensive Connectivity and Support
Edge applications require connectivity, and the EXMP-Q911 offers a repertoire of fast interfaces, which include:
- 36GB LPDDR5X RAM 128GB UFS 3.1 Hard Drive.
- Two 2.5G Ethernet networking ports.
- Vision 4-lane MIPI CSI-2 cameras with 2 channels in high resolution.
- Expansion supports the high-speed interfaces for PCIe Gen4, USB 3.2 and CAN FD.
According to the press release, Innocdisk provides the IQ Studio toolkit and iCAP cloud management platform for streamlining the development. These tools provide developers with open-source BSPs, reference codes, and remote device management capabilities, significantly reducing the time-to-market for complex AI projects.
Innodisk sells the EXMP-Q911 COM‑HPC Mini module through a quote-based model rather than fixed retail pricing, with final prices varying by order volume and configuration. It is available primarily to B2B clients and system integrators through formal Request for Quote (RFQ) inquiries on Innodisk’s website or via industrial distributors. While lead times vary, the product features a long-term availability guarantee extending through 2038.